Components
- 461
- Protochips Inc.
- Offers custom layout and fabrication services for emerging companies and university groups.
- 463
- Silicon Infusion Limited
- Provides single chip solutions for T1/E1/J1, DTMF, ADPCM, and many other telecommunications standards.
- 464
- Silterra Malaysia Sdn Bhd
- Manufacturer of semiconductors and wafers. Headquarters in Kulim, Kedah, Malaysia.
- 465
- WaferTech
- Wafer manufacturing, probing, assembly and final test. .25 micron. Fab in Washington State, USA.
- 466
- Addison Engineering, Inc.
- Vendor of silicon wafers, ceramic packages, and semiconductor materials.
- 467
- Advanced Interconnect Technology
- Provides custom wafer bumping and flip-chip bonding service to the semiconductor wafer fabrication and chip packaging houses.
- 468
- American Precision Dicing, Inc.
- Wafer dicing of hard brittle materials for the semiconductor industry.
- 469
- American Xtal Technology
- Manufactures and sells compound semiconductor substrates, including gallium arsenide, indium phosphide and germanium substrates. (Nasdaq: AXTI)
- 470
- Amkor Technology, Inc.
- Supplier of outsourced semiconductor interconnect and CMOS wafer foundry services.
- 471
- Amtech Systems, Inc.
- Manufactures and markets wafer processing and handling equipment for semiconductor manufacturers. (Nasdaq: ASYS)
- 472
- Benchmark Technologies
- Provides reticles (photomasks) to the MEMS, photonics (waveguides), and semiconductor industries.
- 473
- Cabot Microelectronics Corporation
- Supplies slurries for polishing various materials used in semiconductor manufacturing processes. (Nasdaq: CCMP)
- 475
- DuPont Photomasks
- Photomasks and reticles for semiconductor, LCD and other microelectronics manufacturing.
- 476
- EMCORE Corporation
- Designs and develops compound semiconductor materials, such as gallium arsenide, and process technology. (Nasdaq: EMKR).
- 477
- Global Chip Materials
- Stocking distributor of ceramic packaging materials for microelectronic IC assembly. Online catalog of packaging materials with dimensions and drawings.
- 478
- III/V-Reclaim
- Reclaim (recycles) GaAs and InP 1" to 150mm wafers, removing all layers and structures. Offers single and double side polishing. Based in Germany.