Amkor Technology, Inc.
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Scan day: 12 February 2014 UTC
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Description: Supplier of outsourced semiconductor interconnect and CMOS wafer foundry services.
Amkor Technology: Semiconductor IC Test | Wafer Level Packaging | Wafer Probe | Wafer Bumping | Flip Chip | RF Design | RF Test Flip Chip BGA (FCBGA) Solutions Amkor Flip Chip BGA (fcBGA) packages are assembled around state-of-the-art, single unit laminate or ceramic substrates. Utilizing multiple high density routing layers, laser drilled blind, buried, and stacked vias, and ultra-fine line / space metallization, fcBGA substrates have the highest routing density available. The variety of fcBGA package options allows package selection to be tailored to the specific thermal needs of the end product. Amkor offers fcBGA packaging in a variety of product formats to fit a wide range of end application requirements.
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Contact Information
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WEBSITE Info
| Page title: | Amkor Technology: Semiconductor IC Test | Wafer Level Packaging | Wafer Probe | Wafer Bumping | Flip Chip | RF Design | RF Test |
| Keywords: | amkor, amkor technology, system in package, unitive, wafer bump, wafer bumps, flip chip, amkor packaging, wafer level pacakaging, package on package, PoP |
| Description: | Amkor Technology is the world's leading supplier of outsourced semiconductor interconnect services. With over 35 years of continuous improvement, growth and innovation, Amkor has become a trusted partner for most of the world’s leading semiconductor suppliers. |
| IP-address: | 12.105.180.159 |
WHOIS Info
| NS | Name Server: CBRU.BR.NS.ELS-GMS.ATT.NET Name Server: CMTU.MT.NS.ELS-GMS.ATT.NET |
| WHOIS | Status: clientTransferProhibited |
| Date | Creation Date: 24-apr-1995 Expiration Date: 25-apr-2022 |