Advanced Interconnect Technology
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Scan day: 12 February 2014 UTC
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Description: Provides custom wafer bumping and flip-chip bonding service to the semiconductor wafer fabrication and chip packaging houses.
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WEBSITE Info
| Page title: | Advanced Interconnect Technology (AIT) |
| Keywords: | Advanced Interconnect Technology AIT Bump interconnections Bumps Electronic packaging Gold bumps Indium bumps Copper bumps Lead-Tin bumps Solder bumps Wafer bumping Single die bumping Flip-chip Chip-on-Glass COG Chip-on-Board COB Chip-on-Flex COF Daisy-chain X-ray detectors Infrared detectors IR detectors |
| Description: | |
| IP-address: | 202.153.122.114 |