Components
- 442
- NEC Corp.
- Provider of IT network integrated solutions and semiconductor solutions. Includes product and service information and links to regional sites.
- 443
- NanoAmp Solutions, Inc
- Manufactures low-power analog and linear ICs, as well as low power memory devices.
- 444
- Octasic Semiconductor
- Provides silicon products focused on the challenges of voice processing and packetization for next generation packet based networks.
- 445
- PMC-Sierra, Inc
- Produces MIPS processors in addition to a range of ICs for the communications, storage, and consumer markets.
- 446
- SSC Electronics
- Manufacturer of audio and video ICs and do-it-yourself kits for equalizers, preamps, switchers, mixers, and faders.
- 447
- Samsung Semiconductor
- Manufacturer of a full line of semiconductor devices - Memory, Asic, System.
- 448
- Semtech Corp
- Produces analog and mixed-signal devices for use in communications, portable devices, computers, and industrial equipment.
- 450
- advICo mircroelectronics GmbH
- German based IP (Intellectual Property) provider. Also offers ASIC design services with capabilities up to 40 Gbps.
- 451
- ASE Korea, Inc.
- Assembly and testing services for sensor, wireless, and automotive semiconductors. Facilities in Asia, Europe, and USA. Site lists capabilities including test equipment used, and package datasheets are available in PDF.
- 452
- Cirtek Electronics Corporation
- An independent subcontractor for semiconductor assembly, test and packaging services.
- 453
- Dolphin Technology Inc.
- Provides a wide range of high performance, high speed silicon-IP. For designers, needing standard or custom IP such as memory, I/O, standard cell libraries, data path modules or analog blocks.
- 454
- First Level Inc.
- Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip.
- 458
- Premier Semiconductor Services
- Back-end services for commercial, aerospace, and military products including semiconductor taping, BGA balling, and baking.