First Level Inc.
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Scan day: 12 February 2014 UTC
4
Virus safety - good
Description: Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip.
First Level Inc. - Technology Based Contract Manufacturing Facility First Level Inc. is a technology based contract assembly facility specializing in first level microelectronics packaging. The company has Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and component assembly. Expert engineers and highly skilled technicians provide design, process, and manufacturing services.
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Contact Information
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WEBSITE Info
| Page title: | First Level Inc. - Technology Based Contract Manufacturing Facility |
| Keywords: | First Level Inc, first level microelectronics packaging, wire bonding, contract manufacturing, cleanrooms, die attach, wire bonding, component assembly, electronic design, York, Pennsylvania |
| Description: | First Level Inc. is a technology based contract assembly facility specializing in first level microelectronics packaging. The company has Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and component assembly. Expert engineers and highly skilled technicians provide design, process, and manufacturing services. |
| IP-address: | 173.237.136.167 |
WHOIS Info
| NS | Name Server: NS1.SPEEDYDNS.NET Name Server: NS2.SPEEDYDNS.NET |
| WHOIS | Status: ok |
| Date | Creation Date: 28-mar-2000 Expiration Date: 28-mar-2015 |