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First Level Inc.

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Scan day: 12 February 2014 UTC
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Description: Manufacturing service specializing in microelectronic packaging needs. Offering contract assembly in ESD protected clean rooms, COB, die attach, wirebonding, component pick and place, MCM, BGA, CSP, and flip chip.
First Level Inc. - Technology Based Contract Manufacturing Facility First Level Inc. is a technology based contract assembly facility specializing in first level microelectronics packaging. The company has Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and component assembly. Expert engineers and highly skilled technicians provide design, process, and manufacturing services.
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WEBSITE Info

Page title:First Level Inc. - Technology Based Contract Manufacturing Facility
Keywords:First Level Inc, first level microelectronics packaging, wire bonding, contract manufacturing, cleanrooms, die attach, wire bonding, component assembly, electronic design, York, Pennsylvania
Description:First Level Inc. is a technology based contract assembly facility specializing in first level microelectronics packaging. The company has Class 10,000 ESD protected cleanrooms for die attach, wire bonding, and component assembly. Expert engineers and highly skilled technicians provide design, process, and manufacturing services.
IP-address:173.237.136.167

WHOIS Info

NS
Name Server: NS1.SPEEDYDNS.NET
Name Server: NS2.SPEEDYDNS.NET
WHOIS
Status: ok
Date
Creation Date: 28-mar-2000
Expiration Date: 28-mar-2015