MainBusinessElectronics and ElectricalComponents › American Precision Dicing, Inc.

American Precision Dicing, Inc.

Edit Page
Report
Scan day: 12 February 2014 UTC
6
Virus safety - good
Description: Wafer dicing of hard brittle materials for the semiconductor industry.
American Precision Dicing, Inc. - Quick turn wafer dicing creative solutions to challenging micromachining problems, using precision to cut and machine a variety of hard brittle materials. to be one of the fastest quick turn
Size: 224 chars

Contact Information

Phone&Fax:
Address:
Extended:

WEBSITE Info

Page title:American Precision Dicing, Inc. - Quick turn wafer dicing
Keywords:dicing,dising,wafer,scribing,semiconductor,ceramic,sapphire,micromachining,optical,dicing,wafer,waffer,circuit,substrate,micro,hybrid,dicing,wafer,prototype,electro-optical,alumina,quartz,PCB,dicing,wafer,sawing,saw,custom,dicing,wafer,cutting,PZT,fiber,optic,dicing,wafer,ceramic,sapphire,scribing,prototype,alumina,quartz,PCB,sawing,saw,custom,cutting,PZT,fiber,optic,sawing
Description:Provides quick turn precision wafer dicing of hard brittle materials. Customers include telecommunications, biotech, medical, optical, the semiconductor industry, and many others.
IP-address:173.201.92.128

WHOIS Info

NS
Name Server: NS01.DOMAINCONTROL.COM
Name Server: NS02.DOMAINCONTROL.COM
WHOIS
Status: clientDeleteProhibited
Status: clientRenewProhibited
Status: clientTransferProhibited
Status: clientUpdateProhibited
Date
Creation Date: 24-aug-1998
Expiration Date: 23-aug-2015