American Precision Dicing, Inc.
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Description: Wafer dicing of hard brittle materials for the semiconductor industry.
American Precision Dicing, Inc. - Quick turn wafer dicing creative solutions to challenging micromachining problems, using precision to cut and machine a variety of hard brittle materials. to be one of the fastest quick turn
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Page title: | American Precision Dicing, Inc. - Quick turn wafer dicing |
Keywords: | dicing,dising,wafer,scribing,semiconductor,ceramic,sapphire,micromachining,optical,dicing,wafer,waffer,circuit,substrate,micro,hybrid,dicing,wafer,prototype,electro-optical,alumina,quartz,PCB,dicing,wafer,sawing,saw,custom,dicing,wafer,cutting,PZT,fiber,optic,dicing,wafer,ceramic,sapphire,scribing,prototype,alumina,quartz,PCB,sawing,saw,custom,cutting,PZT,fiber,optic,sawing |
Description: | Provides quick turn precision wafer dicing of hard brittle materials. Customers include telecommunications, biotech, medical, optical, the semiconductor industry, and many others. |
IP-address: | 173.201.92.128 |
WHOIS Info
NS | Name Server: NS01.DOMAINCONTROL.COM Name Server: NS02.DOMAINCONTROL.COM |
WHOIS | Status: clientDeleteProhibited Status: clientRenewProhibited Status: clientTransferProhibited Status: clientUpdateProhibited |
Date | Creation Date: 24-aug-1998 Expiration Date: 23-aug-2015 |