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Wafer Bumping

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Scan day: 09 February 2014 UTC
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Description: A site about semiconductor advanced packaging fabrication processes and methods.
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Contact Information

Phone&Fax: 602-334-4125
Address:
Extended:

WEBSITE Info

Page title:Wafer-Bumping.com homepage
Keywords:wafer bumping, consultant, consulting, consultancy, technical consultant, semiconductor, microchips, automotive, microelectronics, communications, silicon foundry, wafer foundry, semiconductor packaging, packaging design, ic layout, circuit layout, circuit design, gdsii layout, electronic assembly, research, development, foundry service, photolithography, etching, plasma, anisotropic etch, flip chip, thin film, integrated circuits, integrated passive, sensor, solder bump, electro-plating, gdsii, high frequency, rf, radio frequency, Si, SiGe, silicon germanium, GaAs, GaN, mixed signal, bipolar, bicmos, cmos, mask shop, wafer, device modeling, polymers, electronic packaging polymer, polyimide, pbo, bcb, passivation
Description:Wafer-Bumping homepage
IP-address:216.55.174.231

WHOIS Info

NS
Name Server: NS1.ABAC.COM
Name Server: NS2.ABAC.COM
WHOIS
Status: ok
Date
Creation Date: 04-may-2003
Expiration Date: 04-may-2014