Bond Strength Measurement in a Three Layer Sandwich
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Scan day: 05 March 2014 UTC
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Description: Liviu Singher, Department of Quality Assurance and Reliability, Agricultural Engineering, Technion - Israel Institute of Technology.
Bond strength measurement in a three layer sandwich Bond strength measurement in a three layer sandwich Acoustic wave propagation in a three-layer wave guiding configuration is presented. Considering an adhesive layer as a waveguide structure, it is shown that the propagation of guided modes is affected by the bonding quality. A quasi-static model is proposed for ultrasonic guided waves interaction with imperfect interfaces. Incomplete bonding and the effect of this condition on the velocity is discussed. The theoretical model, serves as reference for extracting ultrasonic wave parameters from experimental data. These parameters are correlated to adhesion strength. This paper presents the results of a series of experiments with bonds of varying quality and thickness. Ultrasonic surface waves have been generated by a piezoelectric transducer and the detection is performed using an optical interferometer.
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| Page title: | Bond strength measurement in a three layer sandwich |
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