Electromigration
Edit Page
Report
Scan day: 03 February 2014 UTC
27
Virus safety - good
Description: Surface electromigration refers to the directed motion of atoms (adatoms) at solid surfaces, grain boundaries and interfaces which is caused by an electric current in the bulk of the material. It is considered a key factor determining the reliability of integrated circuits.
Surface electromigration refers to the directed motion of atoms (adatoms) at solid surfaces, grain boundaries and interfaces which is caused by an electric current in the bulk of the material. It is considered a key factor determining the reliability of integrated circuits. As miniaturization progresses and current densities increase, a detailed understanding of failure mechanisms is needed to safely extrapolate from an accelerated testing environment to actual operating conditions. It has been shown that a new type of failure appears when the line width of metallic interconnects becomes comparable to or smaller than the grain size of the film. In this "bamboo" regime grain boundaries no longer provide connected diffusion paths along the conductor line. Instead, failure occurs due to
Size: 804 chars
Contact Information
Email: —
Phone&Fax: —
Address: —
Extended: —
WEBSITE Info
| Page title: | AG_Krug |
| Keywords: | |
| Description: | |
| IP-address: | 134.91.212.131 |
WHOIS Info
| NS | ns1.netz.uni-essen.de 132.252.3.10 2001:638:501:4003:0:0:0:10 ns2.netz.uni-essen.de 132.252.1.7 2001:638:501:4001:0:0:0:7 |
| WHOIS | Status: connect |
| Date | Changed: 2011-07-10T19:09:06+02:00 Changed: 2011-06-17T12:42:08+02:00 Changed: 2010-12-01T16:45:06+01:00 |