BroadPak Corporation
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Scan day: 01 May 2020 UTC
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Description: Provider of semiconductor package substrate design services, signal/power/thermal integrity analysis, test engineering and assembly project management.
signal integrity, high speed, high speed signal integrity, TSV, TGV, through silicon via, silicon interposer, 3D silicon interposer signal interity, through glass via, micro bump, copper pillar, IR drop, substrate design, flip chip, cavity down, power integrity, CO design, reliability modeling, 3D package, 3D packaging, advanced packaging, package design, ball grid array, ball stack, BGA, chip scale, chip scale package, CSP, DDR II, die stack, die stacking, FBGA, fine pitch BGA, land grid array, MBGA, MCP, memory modules, memory stacking, multi chip, multi chip package, package design, package solutions, package stacking, packaging, RF module, semiconductor packaging, system in a package, SIP, stacked, stacking, system in package, system integration, system level integration, system miniaturization, broadpak, thermal management, thermal modeling, 3D wafer level packaging, WLP
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WEBSITE Info
| Page title: | signal integrity, high speed, high speed signal integrity, TSV, TGV, through silicon via, silicon interposer, 3D silicon interposer signal interity, through glass via, micro bump, copper pillar, IR drop, substrate design, flip chip, cavity down, power integrity, CO design, reliability modeling, 3D package, 3D packaging, advanced packaging, package design, ball grid array, ball stack, BGA, chip scale, chip scale package, CSP, DDR II, die stack, die stacking, FBGA, fine pitch BGA, land grid array, MBGA, MCP, memory modules, memory stacking, multi chip, multi chip package, package design, package solutions, package stacking, packaging, RF module, semiconductor packaging, system in a package, SIP, stacked, stacking, system in package, system integration, system level integration, system miniaturization, broadpak, thermal management, thermal modeling, 3D wafer level packaging, WLP |
| Keywords: | signal integrity, high speed, high speed signal integrity, TSV, through silicon via, through glass via, IR drop, substrate design, flip chip, cavity down, power integrity, CO design, reliability modeling, 3D package, 3D packaging, advanced packaging, package design, ball grid array, ball stack, BGA, chip scale, chip scale package, CSP, DDR II, die stack, die stacking, FBGA, fine pitch BGA, land grid array, MBGA, MCP, memory modules, memory stacking, multi chip, multi chip package, package design, package solutions, package stacking, packaging, RF module, semiconductor packaging, system in a package, SIP, stacked, stacking, system in package, system integration, system level integration, system miniaturization, broadpak, thermal management, thermal modeling, 3D wafer level packaging, WLP. |
| Description: | 3D packaging ball grid array, chip scale packaging, semiconductor packaging, multi-chip package, package stacking, system level integration. broadpak produces and provides a broad range of advanced packaging solutions from stacked chip solutions to wafer level packaging. |
| IP-address: | 66.96.149.17 |
WHOIS Info
| NS | Name Server: NS1.STARTLOGIC.COM Name Server: NS2.STARTLOGIC.COM |
| WHOIS | Status: clientTransferProhibited https://icann.org/epp Domain Status: clientUpdateProhibited https://icann.org/epp Name Server: NS1.STARTLOGIC.COM |
| Date | Creation Date: 2007-07-21T02:45:41Z Last update of whois database: 2020-05-01T13:39:06Z <<< Expiry Date: 2020-07-21T02:45:41Z |