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Spherical Power Industries

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Scan day: 05 February 2014 UTC
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Description: Solder spheres for BGA and powders for electronics PCB.
IPS Solder powders Solder spheres optimized industrial technology is specifically designed to address the needs of high quality interconnect products for the electronic assembly and semiconductor packaging industries. Privately held, the company developed unique in-house ultrasonic atomization process to manufacture Solder Powder for Solder paste application and Solder Spheres to serve the semiconductor packaging industry.
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Page title:IPS Solder powders Solder spheres
Keywords:spherical powder industry, ips, spherical powder, solder ball, solder sphere, solder cream, solder paste, solder powder, alloy powder, lead free, lead free solder powder, metal powder, solder, metal, powder, alloy, sphere, PCB, PWB, SMT, solder ball bga, solder sphere bga, solder powder paste, sphere bumping, paste dispensing, cream, dispensing, lead free alloys, solder material, solder, backend material, electronic assembly, surface mount technology, Ball Grid Array, BGA, PBGA, ceramic Ball Grid Array, CBGA, fine pitch, FBGA, Chip Scale Package, CSP memory module, module, DDR, no-clean, water soluble, re-balling, powder atomisation, metal atomization, SAC105, SAC305, SAC405, lead free solder material, semiconductor packaging material, lead free solder, lead free powder, poudre de soudure, bille de soudure, creme à braser, ips solder
Description:IPS is a wolrd producer of quality interconnect products covering Solder Spheres for the semiconductor packaging industry and Solder Powders for the electronic assembly.
IP-address:194.250.119.54

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Date
Creation Date: 02-jun-1998
Expiration Date: 01-jun-2014