Six Sigma Services
Edit Page
Report
Scan day: 12 February 2014 UTC
14
Virus safety - good
Description: Offering BGA reballing, lead tinning, lead restoration and lead testing.
Subcat: https://morefunz.com/business/electronics-and-electrical/production-equipment-and-materials/?page=7
Six Sigma: Leader in Lead Tinning and Lead Free Services Microelectronic Component Specialist Your expert in Robotic Hot Solder Dip (HSD), Column Attach, Ball Grid Array (BGA) to Column Grid Array (CGA) conversions, Ball Attach, BGA Reballing, and Trim & Form. Also Failure Analysis, Bond Pull, Mark Permanency, Ball Shear, XRF, Solderability, and Fine & Gross Leak Testing.
Size: 400 chars
Contact Information
Email:Send Message
Phone&Fax: —
Address: —
Extended: —
WEBSITE Info
| Page title: | Six Sigma: Leader in Lead Tinning and Lead Free Services |
| Keywords: | Six Sigma, Microelectronis Component Specialists, Robotic Hot Solder Dip, Hot Solder Dip, Ball Attach and Reballing, Column Attach, ISO 9000, Fine and Gross, DSCC, ISO 9001:2000, SAE AS9003, Advanced Packaging Magazine, |
| Description: | Six Sigma, the Microelectronis Component Specialists, specialize in Robotic Hot Solder Dip, Hot Solder Dip, Ball Attach and Reballing, and Column Attach. |
| IP-address: | 66.206.166.200 |
WHOIS Info
| NS | Name Server: NS.NETMAGIC.NET Name Server: NS2.NETMAGIC.NET |
| WHOIS | Status: clientTransferProhibited |
| Date | Creation Date: 25-sep-1998 Expiration Date: 24-sep-2015 |