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Nextek, Inc.

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Description: A specialty firm offering design, analytics, manufacturing, and test for OEMs. Focused on products with high function and advanced interconnect technology. Madison, Alabama, USA.
Nextek, Electronics Design and Manufacturing Services Nextek is a manufacturing specialty company offering advanced design, analytical and manufacturing services to OEMs in the electronics industry. Our focus is high function, electronic assemblies utilizing advanced interconnect technologies to bring customer products from physical design to production.
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Page title:Nextek, Electronics Design and Manufacturing Services
Keywords:electronic manufacturing services, high density interconnect, opto electronics assembly, photonics assembly, printed circuit assembly, printed circuit boards, printed circuit board design, design, PCB, routing, thermo compression bonding, emerging technology, plasma cleaning, pb-free, lead-free, pull testing, destructive testing, non-destructive testing, shear testing, high mix, wire bonding, low volume, dam and fill, laser profiling, wedge-bonding, glob top, die placement, flip chip, underfill, overmold, BGA, BGA assembly, opto-electronics, opto electronics, component design, DFM, gerber file generation, electrical design, microelectronics assembly, surface mount assembly, chip on board, flip chip assembly, fiber optic assembly, LVSEM, XRAY, X-Ray, SEM, EDS, EDX, SEM/EDS, SEM/EDX, CSAM, SAM, XRF, ionic contamination, metallurgical, cross-section, cross-sections, microscope, PCB cross-section, decap, decapsulation, IC decapsulation, failure analysis, PCB failure analysis, component failure analysis, FTIR, paragon,industrial design, mechanical design, GSE, Ground Support Equipment, Build to Print, Box Build, Prototype Build, SLA, SLS, FDM, Urethane Casting, Plastic Injection Mold, Metal Injection Mold, Sheetmetal, Sheet Metal ,Enclosure Development, FEA, Stess Analysis, Thermal Analysis, Motion Analysis, Cable & Harness Design, Cable Design, Harness Design,CNC Tool Path Creation, Mold Design, ProE, ProEngineer, Mechanica, ISDX, Diagram,Pro/Intralink, Pro Intralink, Surface Modeling, Solid Modeling, Assembly Design, Mechanism Design, Assembly Animation, pcb design, root cause failure analysis, ground-up product development, integrted design solutions, value engineering, product enhancement, product styling, ergonomic design, product branding,functional modeling, concept, development, electronic enclosure design, enclosure design, human factors design, medical device design, medical product development, medical product manufacturing, consumer electronics design, product styling, renderings, 3d renderings, conceptual rendering, mechanical engineering, design for manufacturability, 3D modeling, assembly development, rapid prototyping, advanced packaging design, high complexity, high density, high functionality, high value, reliability and performance optimization, applied creativity, mentor graphics, cadence allegro, pads, powerpcb, orcad, 3D solid modeling, 3D surface modeling, legacy CAD translation, manufacturing outsourcing, design outsourcing, design RFQ, RFQ, Request for Quote, product development, reverse engineering, electronics manufacturing, production assembly, NPI, New Product Introduction, quick turn assembly, turn key, turnkey, manufacturing, project managment, product development, NPI, concept, Automotive Products, Aerospace Hardware, Consumer electronics, Commercial Products, Industrial products, Medical products, Military Hardware, Outdoor Products, Industrial Products, Telecommunication Equipment/Products, RoHS, RoHS Compliance, RoHS Assembly, Lead-free, Lead Free, Lead Free Design, RoHS Design, Military Electronics Assembly, Military PCB Assembly, New Product Development
Description:electronic manufacturing services for advanced technology,high density electronic assemblies
IP-address:206.166.254.10

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Status: clientTransferProhibited
Date
Creation Date: 05-nov-1997
Expiration Date: 04-nov-2014