LEW Techniques
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Scan day: 02 February 2014 UTC
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Description: Specialist manufacturer of miniature precision metallized ceramic and/or metal package components and packages for optoelectronic, microwave and general semiconductor devices. Includes techniques, processes and close ups of products.
Manufacturing microelectronic components offering solutions for optoelectronic, semiconductor, hybrid and microwave applications Brazing, soldering, epoxy joining Design Advice - performance, yield Contract manufacturing and assembly
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Contact Information
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WEBSITE Info
| Page title: | L.E.W. Techniques |
| Keywords: | metallised,ceramic,package,multi-layers,wrap-around,wraparound,hermetic,through,hole,thru-hole,heatsinks,feedthroughs,copper,tungsten,sapphire windows,molybdenum,kovar,OFHC,sapphire,hermetic,windows,jumper,blocks,mounting,alumina,aluminium,nitride,standoffs,semiconductor,dielectrics,wire,bonding,sn/pb,tin/lead,sn/pb/ag,tin/lead/silver,au/sn,gold/tin,au/ge,gold,germanium,au/cu,gold,copper,brazing,lids,soldering,pre-forms,nickel,iron,nickel-iron-cobalt,electroplating,electroless,gold,contract,manufacturing,outsource,recovery,re-package,re-claim,jobs |
| Description: | L.E.W. Techniques; Specialist Manufacturer of Metallised Ceramic and Metal Components and Assemblies. |
| IP-address: | 84.22.162.183 |
WHOIS Info
| NS | Name servers: ns1.namecity.com ns2.namecity.com |
| WHOIS | |
| Date | Last updated: 27-Feb-2013 Expiry date: 29-Mar-2015 |