Unitemp GmbH
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Scan day: 20 February 2014 UTC
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Description: Develops equipment for semiconductor processes, including small process furnaces, reflow solder ovens, annealing and baking systems, hot plates, and wire bond tools. Product photos and data sheets.
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Contact Information
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WEBSITE Info
| Page title: | UniTemp GmbH | Home |
| Keywords: | High vacuum sealer for MEMS, Hot chucks with external controller, Hot plates with Lift Pins, Hot Plates with integrated controller, Plasma Cleaning, Heat, Press Releases, Rapid Thermal Process Ovens, Reflow Solder Systems, Request Formular, Shows, Wafer scriber manual, Wire bond tools, WIre Bonder, Die Bonder |
| Description: | We develop and sell equipment for microelectronics. Our main focus is based on thermic process engineering. UniTemp combines the technical, ergonomical and economical function with perfect harmony in technics and design to achieve best quality. All UniTemp products are developed and manufactured in Germany. |
| IP-address: | 82.165.92.1 |
WHOIS Info
| NS | |
| WHOIS | Status: connect |
| Date | Changed: 2010-11-24T19:18:13+01:00 Changed: 2012-12-10T20:50:22+01:00 Changed: 2012-12-10T20:50:22+01:00 |