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TCG Inc.

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Description: Manufacturers' representatives for semiconductor process and inspection equipment. Mask alignment, contact and proximity printing, automated visual inspection, surface profiling, wafer handling and sorting, wafer thickness gauging and metrology.
Semiconductor Manufacturing Process Equipment from TCG Inc. TCG, Inc. is a manufacturers representative serving the Semiconductor Fabrication, Medical and Scientific community since 1992. We are proud to represent the companies listed below. TCG offers Equipment Sales, Service & Applications for many wafer-processing steps. We can solve your problems for Wafer Metrology & Inspection, Wafer Sorting, Film Thickness Measurement & CD Measurement. We also offer solutions for Thickness Gauging, Microscope Wafer Loaders, TSV Measurement, CO2 precision cleaning, Fiber Optic Inspection, Non-Contact Surface Profiling and other Metrology requirements, including custom applications, as well as used & refurbished equipment. Please contact us for prompt attention to your needs.
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Page title:Semiconductor Manufacturing Process Equipment from TCG Inc.
Keywords:Irvine Optical, Wafer Handling, Wafer Sorting, Macro Inspection, Microscope Inspection, Wafer ID Reading, SigmaTech, Wafer Thickness, Wafer Bow, Wafer Warp, Visual Inspection, Scribe Readers, Wafer Edge Handling, Wafer Fab, Metrology, Photolithography, TCG, Cernera, Semiconductor Manufacturing Equipment, Wafer Edge Measurement, 300mm Wafer Tools, Nanometrics, Film Thickness, Foothill Instruments, CD Measurement, Line width Measurement, Critical Dimension Measurement, Thin Film Measurement, Va-Tran Systems, Wafer Cleaning, CO2, CO2 Cleaning, SnoGun, Steam Cleaners, Automated Inspection, Wafer Flatness, Robot Repair, Microscopes, Pax-it, Digital Camera, Digital Imaging, Midwest Information Systems, MIS, Nadatech, PST, EFEM, OCR, Franklin Mechanical, Layer Thickness, Hologenix, PhaseView, Surface Profiling, pre-owned equipment, motorized stages.
Description:Manufacturer's representatives for Semiconductor process and inspection equipment, including: Film Thickness, Mask Alignment, Contact and Proximity Printing, Automated and Manual Visual Inspection, Surface Profiling, Wafer Handling and Sorting, Wafer Thickness Gauging and Metrology, and Wet Process Stations.
IP-address:208.113.152.230

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Creation Date: 16-apr-1999
Expiration Date: 16-apr-2016