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Semiconix Corporation

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Description: manufacturer of custom bipolar ASICs, optoelectronic components,high voltage and high power semiconductors,all offered in die form for flip chip and hybrid applications.
Semiconix SMX, goldchip technology, silicon printed circuit board, known good die manufacturing and bare die wafer foundry group company for Suppliers and Vendors, Semiconix International SEMICONIX has undertaken the task to redesign and manufacture the future semiconductor components compatible with chip and wire, flip chip, chip scale CSP and surface mount technologies. In today's extreme miniaturization market, there is no more room for the large packages to protect the die. It means that the bare die has to survive on its own without the protection of a package. Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. The solution developed by Semiconix Corporation for known good die for bare die applications is gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix designs and manufactures standard and custom semiconductor components for medical, wireless telecommunications, opto-electronics, computing, military and space applications. Semiconix Semiconductor designs and manufactures analog devices built on semiconductor linear technology. Semiconix Semiconductor Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain a large number of undedicated active and passive components, i.e. transistor
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Page title:Semiconix SMX, goldchip technology, silicon printed circuit board, known good die manufacturing and bare die wafer foundry group company for Suppliers and Vendors, Semiconix International
Keywords:wafer foundry, discrete semiconductors, integrated circuits, integrated passive components, BARE DIE ASSEMBLIES, GREEN PACKAGES, LAMINATE CHIP SCALE PACKAGES, MULTI CHIP MODULE PACKAGES CHIP SCALE PACKAGES, INTEGRATED PASSIVE DEVICES ON SILICON PCB, LEAD LESS CHIP SCALE PACKAGES, SYSTEM IN PACKAGE -SIP, CHIP ON BOARD, KNOWN GOOD DIE, LEAD FREE PACKAGES, SILICON SYSTEM IN PACKAGE, FLIP CHIP KNOWN GOOD BARE DIE, MOLDED LEAD FRAME PACKAGES, SILICON PRINTED CIRCUIT BOARD
Description:wafer foundry, discrete semiconductors, integrated circuits, integrated passive components, BARE DIE ASSEMBLIES, GREEN PACKAGES, LAMINATE CHIP SCALE PACKAGES, MULTI CHIP MODULE PACKAGES CHIP SCALE PACKAGES, INTEGRATED PASSIVE DEVICES ON SILICON PCB, LEAD LESS CHIP SCALE PACKAGES, SYSTEM IN PACKAGE -SIP, CHIP ON BOARD, KNOWN GOOD DIE, LEAD FREE PACKAGES, SILICON SYSTEM IN PACKAGE, FLIP CHIP KNOWN GOOD BARE DIE, MOLDED LEAD FRAME PACKAGES, SILICON PRINTED CIRCUIT BOARD
IP-address:207.150.202.13

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Name Server: ADNS.AUS.SITEPROTECT.COM
Name Server: BDNS.AUS.SITEPROTECT.COM
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Date
Creation Date: 10-mar-1999
Expiration Date: 10-mar-2015