Polishing Corporation of America
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Scan day: 12 February 2014 UTC
29
Virus safety - good
Description: Polishing of silicon wafers from 1" to 12" including oxides, metals, wafer reclaim and stripping, slicing, lapping, polishing.
Polishing Corporation of America POLISHING CORPORATION OF AMERICA * TEST * CLEANED * PARTICLE COUNTED * OXIDIZED * METALIZED * THINNED * RECLAIMED * THIN FILMS * POLISHED BOTH SIDES * LASER MARK PCA HAS DEVELOPED A PROCESS OF POLISHING THESE SUBSTRATES ABOUT 9 TIMES AS EASILY AS PREVIOUS PROCESSES. WE PROCESS SUBSTRATES ON OUR ULTRA FLAT POLISHERS. WE ALSO RECLAIM SAPPHIRE SUBSTRATES CONTAINING REJECTED PRODUCTION THIN FILMS. IF YOU NEED FLAT POLISHED SAPPHIRE SUBSTRATES OR RECLAIMING OF YOUR SUBSTRATES,
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Contact Information
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WEBSITE Info
| Page title: | Polishing Corporation of America |
| Keywords: | |
| Description: | |
| IP-address: | 64.14.74.44 |
WHOIS Info
| NS | Name Server: NS1.S450.SURESERVER.COM Name Server: NS2.S450.SURESERVER.COM |
| WHOIS | Status: clientTransferProhibited |
| Date | Creation Date: 11-jul-1996 Expiration Date: 10-jul-2020 |