Loomis Industries Inc
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Scan day: 12 February 2014 UTC
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Description: Designs semiconductor wafer scribing and dicing machines.
Loomis Industries | Patented Scribe and Break Dicing Technology Loomis represents over 30 years of experience in the scribing and breaking of frangible materials for the semiconductor industry. each client's application is unique
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WEBSITE Info
| Page title: | Loomis Industries | Patented Scribe and Break Dicing Technology |
| Keywords: | scriber breaker,scribing, breaking, dicing, scribe dicing, diamond scribing, diamond dicing, wafer scribing, wafer dicing, wafer singulation, wafer processing, laser dicing, saw dicing, GaAs, InP, III-V compounds, gallium nitride, sapphire, silicon, ceramic, glass, laser diodes, mems, microelectromechanical systems, leds, light emitting diodes, smart cards, integrated circuits, discretes, viscels, scribe dicing machines, semiconductor wafer dicing machines, Scribing, Diamond, Dicing, Cleaving, Cleavage, Laser Diode, InP, GaAS, Detector Wafers, Mirror Facets, Laser Cavity, VCSEL, Semiconductor Laser, Facet Coating, High Throughput, Production, Automated, Automation, Skip Scribing, Laser Diode Processing, Crystal Plane, Gallium Arsenide, Indium Phosphide, Nitride |
| Description: | Loomis Industries is situated in Napa Valley. Loomis Industries designs precision wafer dicing machines for the high-technology semiconductor industry. |
| IP-address: | 64.142.106.42 |
WHOIS Info
| NS | Name Server: A.AUTH-NS.SONIC.NET Name Server: B.AUTH-NS.SONIC.NET Name Server: C.AUTH-NS.SONIC.NET |
| WHOIS | Status: clientDeleteProhibited Status: clientTransferProhibited Status: clientUpdateProhibited |
| Date | Creation Date: 26-jun-1998 Expiration Date: 25-jun-2014 |