Hybrionic Pte Ltd
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Scan day: 20 February 2014 UTC
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Description: Singapore based design house with ability to manufacture and aid in the design of thick-film, chip and wire, and discrete hybrid microcircuits with custom packaging.
Thick film microcircuits, Hybrid microcircuits, Hybrid Circuits, custom hybrid, Hybrid assembly, Hybrid packaging, print fired and trimmed (PFT) substrates, PFT, Chip scale packaging, Wire bonding, ceramic circuits, HIC, Laser Trimming, Microcircuit assembly, Micro-circuits, Thick film, Thick film assembly, Thick Film Circuit Assembly, thick film circuits, HIC, SMT, SMT Assembly, manufacture in Singapore, One stop manufacturing, Hybrionic
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Contact Information
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WEBSITE Info
| Page title: | Thick film microcircuits, Hybrid microcircuits, Hybrid Circuits, custom hybrid, Hybrid assembly, Hybrid packaging, print fired and trimmed (PFT) substrates, PFT, Chip scale packaging, Wire bonding, ceramic circuits, HIC, Laser Trimming, Microcircuit assembly, Micro-circuits, Thick film, Thick film assembly, Thick Film Circuit Assembly, thick film circuits, HIC, SMT, SMT Assembly, manufacture in Singapore, One stop manufacturing, Hybrionic |
| Keywords: | Thick film microcircuits,Hybrid microcircuits,Microcircuits, Hybrid IC, Ceramic Screening, CSP - Chip scale packaging, Polymer printing, Wire bonding, Hybrid assembly, Hybrid packaging, ceramic circuit, ceramic circuits, HIC, hybrid, Hybrid Circuits, hybrids, Laser Trimming, Microcircuit assembly, microcircuits, Micro-circuits, multi-layer circuits, SMT, SMT Assembly, Thick film, Thick film assembly, Thick Film Circuit Assembly, thick film circuits, Thick Film HIC, Wire Bonding |
| Description: | Thick film microcircuits,Hybrid microcircuits,Microcircuits, Hybrid IC, Ceramic Screening, CSP - Chip scale packaging, Polymer printing, Wire bonding, Hybrid assembly, Hybrid packaging, ceramic circuit, ceramic circuits, HIC, hybrid, Hybrid Circuits, hybrids, Laser Trimming, Microcircuit assembly, microcircuits, Micro-circuits, multi-layer circuits, SMT, SMT Assembly, Thick film, Thick film assembly, Thick Film Circuit Assembly, thick film circuits, Thick Film HIC, Wire Bonding |
| IP-address: | 203.123.11.15 |
WHOIS Info
| NS | Name Server: NS1.ILABS.COM.SG Name Server: NS2.ILABS.COM.SG |
| WHOIS | Status: clientDeleteProhibited Status: clientTransferProhibited |
| Date | Creation Date: 17-sep-1996 Expiration Date: 16-sep-2015 |