Grinding and Dicing Services, Inc.
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Scan day: 20 February 2014 UTC
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Description: Offers wafer grinding, dicing, polishing and flip chip service to transfer wafer dice to tape and reel.
Wafer Grinding | Wafer Polishing | Wafer Dicing | Wafer Inspection | Wafer Pick and Place | Grinding and Dicing | Grinding and Dicing Services, Inc. Thin wafer technology increases the function density of IC packaging, enabling the development of more portable electronics. To achieve the desired results for your specific project, GDSI continuously researches emerging applications targeting unit cost reduction and maximum product yield. GDSI has perfected the process of mechanical stress reduction in ultra-thin wafers after a decade of R&D.
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Contact Information
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WEBSITE Info
| Page title: | Wafer Grinding | Wafer Polishing | Wafer Dicing | Wafer Inspection | Wafer Pick and Place | Grinding and Dicing | Grinding and Dicing Services, Inc. |
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| Description: | |
| IP-address: | 206.188.193.203 |
WHOIS Info
| NS | Name Server: NS10.WORLDNIC.COM Name Server: NS9.WORLDNIC.COM |
| WHOIS | Status: clientTransferProhibited |
| Date | Creation Date: 12-sep-1997 Expiration Date: 11-sep-2014 |